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2 Sonic Assist Although not in common use, another accessory imparts highamplitude sonic pulses into the solder waveThis can help drive solder into PTHs and increase wetting, especially on thick printed wiring boards Care must be taken during setup, as very high amplitudes may pump so much solder up the barrel that it may result in topside solder bridging or solder splashing This feature can help with barrel fill on thick PWBs Its value is limited, since it does not affect board heating, which is the primary factor in barrel fill 4746 Wave-Solder Diagnostics As in all cases of mass soldering, the use of a product-specific, fully populated time-temperature profile board is necessary to ensure that critical areas of the board to be soldered are maintained at proper temperatures for each stage of the process.

Topside SMT component solder joints must be kept well below the melting point of the solder used to join them to the PWB At the same time, PTH barrels and PTH components must surpass liquidus temperature to guarantee sufficient wetting and capillary rise of the molten solder With the complexity of today s mixed-mount boards, this is more of a challenge than ever A profile board should be constructed and instrumented just as for oven reflow soldering, but thermocouples should be attached to both sides of the board and monitored simultaneously during the wave-solder profile run Topside SMT solder joints should be monitored to ensure that they stay beneath the reflow temperature of the solder alloy being used Connector bodies should be monitored to ensure that they are not overheated.

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Generally, for 63Sn/Pb solder, a temperature of approximately 120 C is chosen for maximum preheat to preclude reaching reflow temperature (183 C) on the top side of the board when the board touches the molten wave Of course, this thermal limit varies greatly with board size, thickness, component type, number of board layers, number of connections to inner planes, thickness of inner planes, component layout density, etc In the case of Pb-free solder, the preheat temperature should be about 50 to 70 C less than the liquidus temperature of the soldering alloy used for SMT The use of wave pallets (shields) in the context of selective wave soldering will be discussed later..

For example, silicon has a density of 2300 kg/m3 and a modulus of elasticity of 170 GPa The velocity of sound for silicon is approximately 8500 m/sec The spring and mass system for MEMS is also governed by Newton s second law and Hooke s law Figure 812 shows Newton s second law, whereas Figure 813 illustrates Hooke s law For a condition with no friction and no damping, the following relation is obtained: Fapp + Fsp = 0 & mx& = kx Fig 811: Electrostatic actuation [8]

In addition to the profile board, there are numerous useful diagnostic tools commercially available for dynamically measuring the wave height and wave contact area and assessing resident time in the wave for a given conveyor speed. 47.4.7 Dross Hot solder is prone to rapid oxidation at the air-liquid solder interface. Although the wave is in constant motion, the solder is actually flowing beneath a thin, stationary, plastic film of solder oxides. In Sn/Pb, Sn-Cu, or Sn-Ag-Cu systems, the skin is composed chiefly of tin oxide but also contains oxidized traces of other alloy constituents or contaminants. The oxide skin on the surface of the wave and atop the solder in the reservoir is called dross. The dross has a beneficial aspect in that it helps to limit oxidation of the recirculating solder in the solder pot, but it also interferes with solder-wave dynamics. When adjusted properly, the board meets the crest of the wave and disrupts the oxide skin. In doing so, the fluxed components and board are immersed in the flowing, oxide-free molten solder. If all steps are carried out properly, the solder alloys with the fluxed, oxide-free component leads, component pads, and PTH barrels. Upon exiting the wave solder machine, the assembly cools below the solder liquidus temperature and solder joints are formed. The more the system is used to solder boards, the faster the contamination and dross build-up. 47.4.7.1

Dross is of concern from three points of view:

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